We open up next-generation assembly technology for semiconductor with leading-edge technologies and information that we have developed over many years. As the de facto standard, our products are used in the research and development site world wide.
Our well experienced architects can also custom-make TEG to better suit your needs. A wide variety of film sputtering and deposition, back- griding, dicing, bump forming, assembing and analysis are available. Our high-quality service are all Made in Japan!
