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KITPRODUCTS

KIT製品一覧表

Product

Ni/Au


Cu


Cu
+OSP

E-679FG
SAC

E-700G
SAC
 
E-705G
SAC
 
E-700G
NiPdAu+
SAC

E-705G
NiPdAu+
SAC

NiPdAu
CC80
FC150LC-1×1  
FC120-1×1
FC120-2×2
FC150-1×1    
FC150-2×2
FC200-1×1    
FC200-2×2    
WLP300P/400P
     

その他のKIT製品



KIT製品詳細



WALTS-KIT CC80(T)-0106JY【MAP】

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Specification WALTS-KIT CC80(T)-0106JY【MAP】
Structure 1-2-1 Build up Substrate
Layer Structure Layer 1, 2 Signal Layer(Via)
Layer 3, 4 Mesh
Outline 187.5mm×64.0mm×t(0.36mm)
Material Core: HL832NSF
Build Layer: GHPL-830NSF
Solder Resist Material PSR4000 AUS-308
Lead Min L/S 32µm/48µm
Number of Lead 648
Pad Dimensions φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad 72 pads
Electrode Cu + OSP


WALTS-KIT CC80CL-0100JY【MAP】

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Specification WALTS-KIT CC80CL-0100JY【MAP】
Structure Coreless 3L
Layer Structure Layer 1, 2 Signal Layer(Via)
Layer 3 Mesh
Outline 187.5mm×64.0mm×t(0.16mm)
Material Build Layer: GHPL-830NSF
Solder Resist Material PSR4000 AUS-308
Lead Min L/S 32µm/48µm
Number of Lead 648
Pad Dimensions φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad 72 pads
Electrode Cu
Cu + OSP

WALTS-KIT FC150LC(S)-0303JY

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Specification WALTS-KIT FC150LC(S)-0303JY
Layer Structure 2-2-2 Build up Substrate
Outline 55.0mm×55.0mm×t(0.66mm)
Material Build Layer:ABF-GX13
Solder Resist PSR4000 AUS-703
Land Size φ0.13mm●
Number of Lead 25921 (161×161)
SR Opening φ85μm●
Number of Measurement Pad 240 pads
Daisy Pattern ① Daisy Chain Pattern A: 196 Pads(14×14)
② Daisy Chain Pattern B: 72 Pads(12×6)
③ Daisy Chain Pattern C: 169 Pads(13×13)
④ Daisy Pattern D: 12 Pads(4×3)
Electrode Electroless Plating: Ni/Pd/Au
Electroless Plating: Ni/Pd/Au+SnAgCu


WALTS-KIT 01A120P(S)-10 1×1

/KIT_01A120P(S)-10
Specification WALTS-01A120P(S)-10 1×1
Structure Rigid Substrate (Both)
Outline 30.0mm×30.0mm×t(0.97mm)
Material Core: MCL-E-705G
Build Layer:ABF-GX92
Solder Resist PSR4000 AUS-703
Land Size φ0.095mm●
Number of Lead 5776 (76×76)
SR Opening φ70μm●
Number of Measurement Pad 24 pads
Daisy Chain Center Area 18×20 Matrix
Corner Area 19×20 four Matrix
Electrode Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT FC120(S)-101JY 2×2

/KIT_FC120(S)
Specification WALTS-FC120(S)-0101JY 2×2
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.97mm)
Material Core: MCL-E-705G
Build Layer:ABF-GX92
Solder Resist PSR4000 AUS-703
Land Size φ0.095mm●
Number of Lead 23104 (5776/chip×4)
SR Opening φ70μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 38×40 Matrix
Corner Area 19×20 four Matrix
Electrode Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT 01A150P(S)-10-3 1×1

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Specification WALTS-KIT 01A150P(S)-10-3 1×1
Structure Rigid Substrate (Both)
Outline 30.0mm×30.0mm×t(0.98mm)
Material Build Layer:ABF-GX92
Solder Resist PSR4000 AUS-703
Land Size φ0.12mm●
Number of Lead 3721 (61×61)
SR Opening φ80μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 16×15 Matrix
Corner Area 15×15 four Matrix
Electrode Cu + OSP (option Solder Coat)
Electroless Ni/Au Plating
*OSP: Organic Solderability Preservatives

WALTS-KIT FC150(S)-0106JY 2×2(E-700G)

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Specification WALTS-KIT FC150(S)-0106JY 2×2
(E-700G)
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.98mm)
Material Build Layer:ABF-GX92
Solder Resist PSR4000 AUS-703
Land Size φ0.12mm●
Number of Lead 14884 (3721/chip×4)
SR Opening φ80μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 30×30 Matrix
Corner Area 15×15 four Matrix
Electrode Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT 01A200P(S)-10-2 1×1

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Specification WALTS-KIT 01A200P(S)-10-2 1×1
Structure Rigid Substrate (Both)
Outline 30.0mm×30.0mm×t(0.97mm)
Core Material Build Layer:ABF-GX92
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 2116 (46×46)
Vehicle 10mm×10mm 200μm pitch area
SR Opening φ95μm●
Number of Measurement Pad 24 pads
Daisy Chain Center Area 12×12 Matrix
Corner Area 12×11 four Matrix
Electrode Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT FC200-0102JY 2×2

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Specification WALTS-KIT FC200-0102JY 2×2
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.87mm)
Material core: E-700GR
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 8464 (2116/chip×4)
Vehicle 20mm×20mm 200μm pitch area
SR Opening φ95μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 20×18 Matrix
Corner Area 12×11 four Matrix
Electrode Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT WLP(S)300P/400P-2

WLP_300P400P
Specification WALTS-KIT WLP(S)300P/400P-2
* for WLP TEG (0.4mm pitch & 0.3mm pitch)
Structure 1-2-1 Build up Substrate
Layer Structure Layer1:WLP300P
Layer4:WLP400P
Outline 30.0mm×30.0mm×t(0.98mm)
Core Material Core: E-679FGR
Build Layer: ABF-GX13
Solder Resist Material PSR4000 AUS-703
Number of Lead WLP300P: 264
WLP400P: 144
Pad Dimensions 2.4mm×4.0mm
(SR opening: 2.2mm×3.8mm)
Number of Measurement Pad 15 pads
Electrode Electroless Ni/Au plating 

WALTS-KIT LCD30A-0101JY

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Specification WALTS-KIT LCD30A-0101JY
Material Non Alkali Glass
Outline 52.55mm×24.00mm×t(0.70mm)
Wire Material ITO 1,500Å (option IZO)
 Function ‐‐Daisy Chain
‐‐Breakdown Voltage Check between the Bumps
Conformed Chip WALTS-TEG LCD30A-0101JY

WALTS-KIT COF30-0101JY

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Specification WALTS-KIT COF30-0101JY
State Reel
Product Name S'PERFLEX
Plating Material Sn
Conformed Chip WALTS-TEG LCD30A-0101JY




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