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KIT製品一覧表

Product

Ni/Au


Cu


Cu
+OSP
Core
E-679FG(R)
SAC
Core
E-700G(R)
SAC
 Core
E-700G(R)
NiPdAu
+SAC

 Core
E-705G(R)
NiPdAu
+SAC

Eutectic
Solder

Electro
Sn
MB50-NCR standard/Map
MB50-CR
standard/Map
CC80
CC80-NCR
CC80-FR2
CC80MarkⅡ 
FC150LC-1×1    
FC150-1×1    
FC150-2×2
FC150R-2×2
FC200-1×1    
FC200-2×2    
FC200SC-2×3    
FC200SC-3×3    
WLP300P/400P
EM0101JY    
STAC
     

その他のKIT製品



KIT製品詳細


WALTS-KIT MB50-0102JY_NCR【Standard】UPDATE

MB50-0101JY
Specification WALTS-KIT MB50-0102JY_NCR
*NCR: Non Center Solder Resist
Solder Resist Under Chip MB50-0101JY_NCR
Structure 1-2-1 Build up Substrate
Layer Structure Layer1 Signal Layer (no Via)
Layer2~Layer4 Mesh
Outline 17.0mm×17.0mm×t(0.8mm~1.0mm)
Core Material Core: E-679FGR
Build Layer: ABF-GX13
Solder Resist Material PSR4000 AUS-703
Lead Min L/S 20μm/30μm
Number of Lead 536
Pad Dimensions φ0.8μm (SR opening: φ0.65μm)
Number of Measurement Pad 32 pads
Elctrode Electroless Ni/Au plating 

WALTS-KIT MB50-0104JY_CR【Standard】
WALTS-KIT MB50-0105JY_CR【Standard】UPDATE

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Specification WALTS-KIT MB50-0104JY_CR
WALTS-KIT MB50-0105JY_CR
*CR: Center Solder Resist
Solder Resist Under Chip MB50-0101JY_CR
Structure 1-2-1 Build up Substrate
Layer Structure Layer1 Signal Layer (no Via)
Layer2~Layer4 Mesh
Outline 17.0mm×17.0mm×t(0.8mm~1.0mm)
Core Material WALTS-KIT MB50-0104JY_CR
 Core: E-679FGR
 Build Layer: ABF-SH9K

WALTS-KIT MB50-0105JY_CR
 Core: E-679FGR
 Build Layer: ABF-GX13
Solder Resist Material WALTS-KIT MB50-0104JY_CR
 PFR800AUS-410

WALTS-KIT MB50-0105JY_CR
 PSR4000 AUS-703
Lead Min L/S 20μm/30μm
Number of Lead 536
Pad Dimensions φ0.8μm (SR opening: φ0.65μm)
Number of Measurement Pad 32 pads
Electrode WALTS-KIT MB50-0104JY_CR
 Electroless Ni/Au plating

WALTS-KIT MB50-0105JY_CR
 Electroless Ni/Au plating
 Cu + OSP
 Cu (option: Solder Coat / Sn Coat)

 *OSP: Organic Solderability Preservatives

WALTS-KIT MB50-0102JY_NCR【MAP】UPDATE

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Specification WALTS-KIT MB50-0102JY_NCR【MAP】
*NCR: Non Center Solder Resist
Solder Resist Under Chip MB50-0102JY_NCR
Structure 1-2-1 Build up Substrate
Layer Structure Layer1 Signal Layer (no Via)
Layer2~Layer4 Mesh
Outline 187.5mm×64.0mm×t(0.36mm)
Core Material Core: E-679FGBS
Build Layer: GX-13
Solder Resist Material PFR800 AUS-410
Lead Min L/S 20μm/30μm
Number of Lead 536
Pad Dimensions φ0.8μm (SR opening: φ0.65μm)
Number of Measurement Pad 32 pads
Electrode Electroless Ni/Au plating
Cu+OSP

WALTS-KIT MB50-0103JY_CR【MAP】UPDATE
WALTS-KIT MB50-0104JY_CR【MAP】
UPDATE

Specification WALTS-KIT MB50-0103JY_CR【MAP】
WALTS-KIT MB50-0104JY_CR【MAP】
*CR: Center Solder Resist
Solder Resist Under Chip MB50-0103JY_CR, MB50-0104JY_CR
Structure 1-2-1 Build up Substrate
Layer Structure Layer1 Signal Layer (no Via)
Layer2~Layer4 Mesh
Outline 187.5mm×64.0mm×t(0.36mm)
Core Material Core: E-679FGBS
Build Layer: ABF-GX92
Solder Resist Material PSR4000 AUS-703
Lead Min L/S 20μm/30μm
Number of Lead 536
Pad Dimensions φ0.8μm (SR opening: φ0.65μm)
Number of Measurement Pad 32 pads
Electrode WALTS-KIT MB50-0103JY_CR【MAP】
 Electroless Ni/Au plating
 Cu + OSP
 Cu (option: Solder Coat / Sn Coat)

WALTS-KIT MB50-0104JY_CR【MAP】
 Electro Sn plating

 *OSP: Organic Solderability Preservatives

WALTS-TEG IP40-0101JY *Silicon Interposer NEW!!

TEG_IP40
Specification WALTS-TEG IP40-0101JY
*Silicon Interposer
[for WALTS-TEG CC40-0101JY]
Wafer Size φ 8 inch
Wafer Thickness 725±25μm
Chip Size 10.0 mm■
Pad Pitch (1)
40μm pitch Full area + Staggered (Model Ⅰ)
40μm pitch Staggered (Model Ⅱ)
(2)
250μm pitch Periphera (Outer Pad)
Function -- Daisy Chian
-- Bump Short Check
‐‐ Vernier
-- Breakdown Voltage Check between the Bumps
Bump Size ---
Bump Height ---
Number of Pad Model Ⅰ
(1) 29576 pads/chip
(2) 124 pads/chip (Outer Pad)
Model Ⅱ
(1) 1352 pads/chip
(2) 124 pads/chip (Outer Pad)
Number of Chip 228 chips/wafer
Polyimide (Option) ---

WALTS-TEG IP40A-0101JY *Silicon Interposer NEW!!

TEG_IP40
Specification WALTS-TEG IP40A-0101JY
*Silicon Interposer
[for WALTS-TEG CC40-0101JY]
Wafer Size φ 12 inch
Wafer Thickness 775±25μm
Chip Size 10.0 mm■
Pad Pitch (1) 40μm pitch Full area + Staggered
(2) 250μm pitch Periphera (Outer Pad)
Function -- Daisy Chian
-- Bump Short Check
‐‐ Vernier
-- Breakdown Voltage Check between the Bumps
Bump Size ---
Bump Height ---
Number of Pad (1) 29576 pads/chip
(2) 124 pads/chip (Outer Pad)
Number of Chip 616 chips/wafer
Polyimide (Option) ---

WALTS-TEG IP80-0101JY *Silicon Interposer  >> CONCEPT

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Specification WALTS-TEG IP80-0101JY
*Silicon Interposer
[for WALTS-TEG CC80-0101JY]
Wafer Size φ 8 inch
Wafer Thickness 725±25μm
Chip Size 10.0 mm■
Pad Pitch (1) 80μm Staggered (Inner Pad)
(2) 300μm Full Area (Center Core)
(3) 250μm Periphera (Outer Pad)
Function Daisy Chian
Bump Size ---
Bump Height ---
Number of Pad (1) 648 pads/chip
(2) 400 pads/chip
(3) 124 pads/chip
Number of Chip 228 chips/wafer
Polyimide (Option)

WALTS-KIT CC80-0104JY【MAP】(Type A / Type B)UPDATE

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Specification WALTS-KIT CC80-0104JY【MAP】
(Type A / Type B)
Structure 1-2-1 Build up Substrate
Layer Structure Layer 1, 2 Signal Layer(Via)
Layer 3, 4 Mesh
Outline Type A: 187.5mm×64.0mm×t(0.36mm)
Type B: 187.5mm×64.0mm×t(0.35mm)
Core Material Core: E-679FGBS
Build Layer: GX-92
Solder Resist Material Type A: PSR4000 AUS-703
Type B: PSR4000 AUS-320
Lead Min L/S 32µm/48µm
Number of Lead 648
Pad Dimensions φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad 72 pads
Electrode Electroless Ni/Au Plating
Cu
Cu + OSP
*OSP: Organic Solderability Preservatives

WALTS-KIT CC80-0104JY_NCR【MAP】 UPDATE

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Specification WALTS-KIT CC80-0104JY_NCR【MAP】
Structure 1-2-1 Build up Substrate
Layer Structure Layer 1, 2 Signal Layer(Via)
Layer 3, 4 Mesh
Outline 187.5mm×64.0mm×t(0.36mm)
Core Material Core: E-679FGBS
Build Layer: GX-92
Solder Resist Material PSR4000 AUS-703
Lead Min L/S 32µm/48µm
Number of Electrode Peripheral: 648
Full Area: 400
Pad Dimensions φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad 72 pads
Electrode Electroless Ni/Au Plating
Cu
Cu + OSP
*OSP: Organic Solderability Preservatives

WALTS-KIT CC80-FR2【MAP】ModelⅠ UPDATE

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Specification WALTS-KIT CC80-FR2【MAP】ModelⅠ
Structure 1-2-1 Build up Substrate
Layer Structure Layer 1, 2 Signal Layer
Layer 3, 4 Mesh
Outline 187.5mm×64.0mm×t(0.35mm)
Core Material Core: E-679FGBS
Build Layer: GX-92
Solder Resist Material PSR800 AUS-410
Solder Resist thickness above Cu metal 10µm
Lead Min L/S 32µm/48µm
Number of Electrode Peripheral: 648
Full Area: 400
Pad Dimensions φ0.75mm (SR opening: φ0.67mm)
Number of Measurement Pad 72 pads
Electrode Cu + OSP
*OSP: Organic Solderability Preservatives

WALTS-KIT CC80MarkⅡ-0201JY【MAP】  >> CONCEPT

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Specification WALTS-KIT CC80MarkⅡ-0201JY【MAP】
Structure 1-2-1 Build up Substrate
Layer Structure Layer 1, 2 Wiringl Layer (Via)
Layer 3, 4 Dummy Layer (Via)
Outline 230.0mm×62.5mm×t(0.36mm)
Core Material Core:HL832NSFLC (0.2mmt)
Build Layer: ABF-GX13
Solder Resist Material PFR800 AUS-410
Lead Min L/S 16µm/24µm
Number of Electrode 1660 (Peripheral)
2916 (Center Core)
Pad Dimensions <Square>
 0.70mm×0.48mm
 (SR opening: 0.62mm×0.40mm)
<Dome>
 0.71mm×0.48mm
 (SR opening: 0.63mm×0.40mm)
Number of Measurement Pad <Square> 68 pads
<Dome> 8 pads
Electrode Cu
Cu + OSP
*OSP: Organic Solderability Preservatives

WALTS-KIT FC150LC-0302JY

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Specification WALTS-KIT FC150LC-0302JY
Layer Structure 2-2-2
Outline 55.0mm×55.0mm×t(0.634mm)
Core Material Core: E-705G
Solder Resist PSR4000 AUS-703
Land Size φ0.13mm●
Number of Lead 25921 (161×161)
SR Opening φ90μm●
Number of Measurement Pad 240 pads
Daisy Pattern ① Daisy Chain Pattern A: 196 Pads(14×14)
② Daisy Chain Pattern B: 72 Pads(12×6)
③ Daisy Chain Pattern C: 169 Pads(13×13)
④ Daisy Pattern D: 12 Pads(4×3)
Electrode Cu
Cu+OSP
Electroless Plating: Ni/Pd/Au
Electroless Plating: Ni/Pd/Au+SnAgCu
Electro Plating: Sn etc.

WALTS-KIT 01A150P-10-2 1×1 UPDATE

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Specification WALTS-KIT 01A150P-10-2 1×1
Structure Rigid Substrate (Both)
Outline 30.0mm×30.0mm×t(0.96mm)
Core Material Core: E-679FGR
Solder Resist PSR4000 AUS-703
Land Size φ0.12mm●
Number of Lead 3721 (61×61)
SR Opening φ80μm●
Number of Measurement Pad 24 pads
Daisy Chain Center Area 16×15 Matrix
Corner Area 15×15 four Matrix
Electrode Electroless Ni/Au Plating
Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT FC150-0104JY 2×2(E-700G) UPDATE

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Specification WALTS-KIT FC150-0104JY 2×2
(E-700G)
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.96mm)
Core Material Core: E-700G
Solder Resist PSR4000 AUS-703
Land Size φ0.12mm●
Number of Lead 14884 (3721/chip×4)
SR Opening φ80μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 30×30 Matrix
Corner Area 15×15 four Matrix
Electrode Electroless Ni/Au Plating
NiPdAu+SAC
Cu + OSP (option Solder Coat)

*OSP: Organic Solderability Preservatives

WALTS-KIT FC150-0103JY 2×2(E-705G)UPDATE

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Specification WALTS-KIT FC150-0103JY 2×2
(E-705G)
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.36mm)
Core Material Core: E-705G
Solder Resist PSR4000 AUS-703
Land Size φ0.12mm●
Number of Lead 14884 (3721/chip×4)
SR Opening φ80μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 30×30 Matrix
Corner Area 15×15 four Matrix
Electrode NiPdAu+SAC

WALTS-KIT FC150R-0102JY 2×2 UPDATE

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Specification WALTS-KIT FC150R-0102JY 2×2
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.96mm)
Core Material Core: E-700G
Solder Resist PSR4000 AUS-703
Land Size φ0.12mm●
Number of Lead 14884 (3721/chip×4)
SR Opening φ80μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 30×30 Matrix
Corner Area 15×15 four Matrix
Electrode Cu
Cu+OSP
Electroless Plating:
  Ni/Pd/Au Plating
  NiPdAu+SAC
  Cu + SAC

*OSP: Organic Solderability Preservatives

WALTS-KIT 01A200P-10 1×1 UPDATE

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Specification WALTS-KIT 01A200P-10 1×1
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.86mm)
Core Material core: E-679FGR
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 2116 (46×46)
Vehicle 10mm×10mm 200μm pitch area
SR Opening φ95μm●
Number of Measurement Pad 24 pads
Daisy Chain Center Area 12×12 Matrix
Corner Area 12×11 four Matrix
Electrode Electroless Ni/Au Plating
Cu
Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT 01A200P-10_C400 1×1 NEW!!○○○○○○○○イメージ

Specification WALTS-KIT 01A200P-10_C400 1×1
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.46mm)
Core Material core: E-679FGR
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 2116 (46×46)
Vehicle 10mm×10mm 200μm pitch area
SR Opening φ95μm●
Number of Measurement Pad 24 pads
Daisy Chain Center Area 12×12 Matrix
Corner Area 12×11 four Matrix
Electrode SnAgCu

WALTS-KIT FC200-0101JY 2×2
WALTS-KIT FC200-0102JY 2×2

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Specification WALTS-KIT FC200-0101JY 2×2
WALTS-KIT FC200-0102JY 2×2
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(0.87mm)
Core Material WALTS-KIT FC200-0101JY 2×2
core: E-679FGR

WALTS-KIT FC200-0102JY 2×2
core: E-700GR
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 8464 (2116/chip×4)
Vehicle 20mm×20mm 200μm pitch area
SR Opening φ95μm●
Number of Measurement Pad 32 pads
Daisy Chain Center Area 20×18 Matrix
Corner Area 12×11 four Matrix
Electrode Electroless Ni/Au Plating
Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT FC200SC-0202JY 2×3 UPDATE

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Specification WALTS-KIT FC200SC-0202JY 2×3
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(1.05mm)
Core Material Core: E-700G
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 2904 (484/chip×6)
Vehicle 10.04mm×15.06mm 200µm pitch area
SR Opening φ95μm●
Number of Measurement Pad 64 pads
Daisy Chain Center Area 8×10 two Matrix
Corner Area 12×11 four Matrix
Out Side Area 7×12 two Matrix
Electrode Electro Ni/Au Plating
Electro Sn Plating
Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT FC200SC-0202JY 3×3 UPDATE

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Specification WALTS-KIT FC200SC-0202JY 3×3
Structure Rigid Substrate (Both)
Outline 35.0mm×35.0mm×t(1.05mm)
Core Material E-700G
Solder Resist PSR4000 AUS-703
Land Size φ0.14mm●
Number of Lead 4356 (484/chip×9)
Vehicle 15.06mm×15.06mm 200µm pitch area
SR Opening φ95μm●
Number of Measurement Pad 64 pads
Daisy Chain Center Area 12×12 Matrix
Corner Area 12×11 four Matrix
Out Side Area 10×7 two Matrix
Out Side Area 7×12 two Matrix
Electrode Electro Ni/Au Plating
Electro Sn Plating
Cu + OSP (option Solder Coat)
*OSP: Organic Solderability Preservatives

WALTS-KIT WLP300P/400P NEW!!

WLP 300P400P
Specification WALTS-KIT WLP300P/400P
* for WLP TEG (0.4mm pitch & 0.3mm pitch)
Structure 1-0-1 Build up Substrate
Layer Structure Layer1, Layer2
Outline 30.0mm×30.0mm×t(0.93mm)
Core Material Core: E-679FGR
Build Layer: ABF-GX13
Solder Resist Material PSR4000 AUS-703
Number of Lead WLP300P: 264
WLP400P: 144
Pad Dimensions 2.4mm×4.0mm
(SR opening: 2.2mm×3.8mm)
Number of Measurement Pad 15 pads
Elctrode Electroless Ni/Au plating 

WALTS-KIT EM0101JY (for Electro Migration Analysis)

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Specification WALTS-KIT EM0101JY
Outline 250.0mm×90.0mm×t(1.53mm)
Core Material Core: E-679GT
Solder Resist Material PSR4000 AUS-703
Lead Min L/S ①L/S=40µm/15µm
②L/S=40µm/20µm
③L/S=40µm/30µm
④L/S=40µm/40µm
⑤L/S=40µm/50µm

WALTS-KIT STAC-0201JY

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Specification WALTS-KIT STAC-0201JY
Structure Rigid Substrate (Both)
Outline 45.0mm×45.0mm×t(0.55mm)
Core Material Core: E-705G
Solder Resist PSR4000 AUS-703
FCA Area Pad Pitch: 300µm
SR Opening: φ110µm
・Top Side: for 1×1 chip, 3×3 chip
・Bottom Side: for 2×2 chip, 4×4chip
Electrode Cu
Cu + OSP
Ni/Au
Ni/Pd/Au+SnAgCu
*OSP: Organic Solderability Preservatives

WALTS-COF TEG-KIT001

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Specification WALTS-COF STANDARD
Core Material S'PERFLEC-S Grade (KAPTON)
S'PERFLEC-US Grade (ESPANEX)
Composition Polyimide: KAPTON (38µm), ESPANEX(34µm)
Cu: Sputtered 8µm
Solder Resist ---
Plating Material Sn (0.2±0.05)
Lead Pitch ①12.5µm/12.5µm
②15.0µm/10.0µm
③10.0µm/15.0µm
④10.0µm/10.0µm
Pad Dimensions 3.0mm×1.5mm

WALTS-KIT LCD30-0101JY

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Specification WALTS-KIT LCD30-0101JY
Material Non Alkali Glass
Outline 52.55mm×24.00mm×t(0.70mm)
Wire Material ITO 1,500Å (option IZO)
 Function ‐‐Daisy Chain
‐‐Breakdown Voltage Check between the Bumps
Conformed Chip WALTS-TEG LCD30-0101JY

WALTS-KIT LCD30-0102JY

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Specification WALTS-KIT LCD30-0102JY
Material Non Alkali Glass
Outline 52.55mm×24.00mm×t(0.70mm)
Wire Material Al-Nd (150nm)
 Function ‐‐Daisy Chain
‐‐Breakdown Voltage Check between the Bumps
Leed Protection Film siN
 Conformed Chip  WALTS-TEG LCD30-0101JY

WALTS-KIT COF30-0101JY

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Specification WALTS-KIT COF30-0101JY
State Reel
Product Name S'PERFLEX
Plating Material Au

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