本文へスキップ

We All Provide TEG & Solutions for JISSO.

TEL. 092-405-8711

      

SIPOS-TEGPRODUCTS


SIPOS-TEG 製品詳細



Specification SI0631
SI0631
Wafer Size 8 inch
Wafer Thickness 725µm±25µm
Chip Size 20.0mm■
Number of Pad 56 pads
Pad Size 160µm■
Number of Chip 57chip