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SIPOS-TEG 製品詳細



Specification SI0601
SI0601
SI0631
SI0631
Wafer Size 8 inch
Wafer Thickness 725µm±25µm
Chip Size 10.0mm■ 20.0mm■
Number of Pad 96 pad 36 pad
Pad Size 160µm■ 160µm■
Number of Chip 198chip 57chip